AI, Micron and Singapore

American tech giant Micron Technology has broken ground for what will be Singapore’s first plant producing advanced ...
Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...
Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...
Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...